Acacia Communications to Demonstrate BGA Photonic Integrated Circuit

March 19 13:00 2017 Print This Article

MAYNARD, Mass., March 20, 2017 (GLOBE NEWSWIRE) — Acacia Communications, Inc. (NASDAQ:ACIA), a leading provider of high-speed coherent optical interconnect products, today announced that it will be demonstrating a ball grid array (BGA) photonic integrated circuit (PIC) for coherent applications during the  Optical Fiber Communication Conference and Exhibition (OFC), taking place March 19th to March 23rd, 2017 at the Los Angeles Convention Center.  In its demonstration, Acacia Communications will show BGA packaging technology that may help Acacia Communications to further leverage the benefits of their silicon photonics by replacing costly optics packages and assembly processes with low-cost packages and standard electronics surface mount technology. 

“We have long viewed the transition to low-cost packaging and standard interfacing as an important next step to further the benefits of our silicon photonics technology,” stated Chris Doerr, Associate Vice President of Integrated Photonics at Acacia Communications.  “With this technical achievement, we continue to execute on our vision to siliconize the optical interconnect, which requires moving from specialized materials that require custom process development to high volume silicon processes and mainstream assembly techniques.”

To help maximize the amount of data transmitted by each coherent interface and improve cost efficiency, Acacia Communications’ next generation Pico digital signal processor (DSP) will support transmission speeds of up to 1.2 Tbps with two carriers of 600 Gbps each using 64QAM modulation format at approximately 64 Gbaud.  For these data rates, traditional packaging technology can limit performance of the interface between the DSP and optics.  BGA packages address this challenge by eliminating additional connectors and optical package leads, improving bandwidth and signal integrity.  This is a critical step toward Acacia Communications’ vision of integrating the DSP and optics in a single package.

“Our relationship with Acacia is one founded on a shared drive to innovate.  Both of our teams are continually pushing and seeking ways to help our customers achieve their goals,” said Christoph Glingener, Chief Technology Officer and Chief Operating Officer at ADVA Optical Networking. “Acacia’s 1.2 Tbps solution is the latest example of this and we strongly believe that it will be significantly beneficial to our customers in the metro Data Center Interconnect market.”   

Acacia Communications’ 1.2 Tbps Pico DSP is based on 16nm CMOS technology and offers a wide range of flexible modulation formats and data rates.  Acacia Communications’ dual core Pico DSP will feature an internal crossbar switch allowing the flexibility to support a wide range of 100G and 400G client interfaces.

About Acacia Communications

Acacia Communications develops, manufactures and sells high-speed coherent optical interconnect products that are designed to transform communications networks through improvements in performance, capacity and cost. By leveraging silicon technology to build optical interconnects, a process Acacia refers to as the “siliconization of optical interconnect,” Acacia is able to offer products at higher speeds and density with low power consumption, that meet the needs of cloud and service providers and can be easily integrated in a cost-effective manner with existing network equipment.

Forward Looking Statements

This press release includes statements concerning Acacia Communications and its future expectations, plans and prospects that constitute “forward-looking statements” within the meaning of the Private Securities Litigation Reform Act of 1995.  For this purpose, any statements contained herein that are not statements of historical fact may be deemed to be forward-looking statements. Without limiting the foregoing, the words “may,” “should,” “expects,” “plans,” “anticipates,” “could,” “intends,” “target,” “projects,” “contemplates,” “believes,” “estimates,” “predicts,” “potential” or “continue” or the negative of these terms or other similar expressions are intended to identify forward-looking statements.  Acacia Communications has based these forward-looking statements largely on its current expectations and projections about future events and financial trends that the Company believes may affect its business, financial condition and results of operations. These forward-looking statements speak only as of the date of this press release and are subject to a number of risks, uncertainties and assumptions including, without limitation, the Company’s anticipated growth strategies, its expectations regarding competition, the anticipated trends and challenges in its business and the market in which Acacia Communications operates, its expectations regarding, and the stability of, its supply chain and manufacturing, the scope, progress, expansion and costs of developing and commercializing its products, the size and growth of the potential markets for its products and the ability to serve those markets, regulatory developments in the United States and foreign countries, including under export control laws or regulations that could impede its ability to sell its products to customers in certain foreign jurisdictions, and other risks set forth under the caption “Risk Factors” in its Form 10-K for the fiscal year ended December 31, 2016 filed with the SEC and its other SEC filings.  Acacia Communications assumes no obligation to update any forward-looking statements contained in this press release as a result of new information, future events or otherwise.

SOURCE Acacia Communications, Inc. 

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Monica Gould
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Jonathan Yaniv
Jonathan Yaniv

Jonathan is the founder and editor-in-chief of Covering major tech shows such as CES, Jonathan is always there for the latest tech news. Want your gadget to be reviewed or have a release you'd like to be considered for publishing? Send Jonathan an email, jonathan [at]

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